MEMS Foundry Services | Photolithography, Etching & Wafer Processing

Photolithography

Photolithography Overview

Photolithography defines micro/nano patterns on photoresist through exposure and development, then transfers the patterns to the substrate through subsequent etching or deposition processes.

Applicable Materials

silicon wafers, glass, sapphire, flexible materials, etc.

Photolithography Capabilities

Contact Lithography	Minimum feature size: 1 μm; overlay accuracy: ±0.5 μm
Stepper Lithography	Projection ratio 1:5; minimum feature size: 0.35 μm; overlay accuracy ≤0.15 μm (X, Y); exposure field <22 × 22 mm
Electron-Beam Lithography	Minimum feature size: 10 nm; overlay accuracy: 40 nm; exposure range: <100 mm diameter

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Etching

Etching Overview

Etching selectively removes materials from wafer surfaces using wet chemicals or dry plasma processes, enabling MEMS cavities, trenches, holes and microstructures.

Etching Chemicals

Alkaline	KOH，TMAH
Acidic	HF, BOE, HCl, HNO₃, etc.

Etchable Materials

silicon, silicon oxide, silicon nitride, metals, quartz and other materials

Etching Capabilities

Ion Beam Etching (IBE)	For metals and other materials that are difficult to etch
Deep Reactive Ion Etching (DRIE)	Etching uniformity <±5%; selectivity >50:1
Reactive Ion Etching (RIE)	For etching Si, SiO₂, SiNₓ and related materials
Focused Ion Beam Etching (FIB)	Enables micro/nano processing such as etching, deposition and doping on materials and devices
Inductively Coupled Plasma (ICP) Etching	For etching GaN, GaAs, InP and other materials

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Thin-Film Deposition

Thin-Film Deposition Overview

Thin-film deposition forms metal, dielectric, optical and composite films on substrates by evaporation, sputtering, LPCVD or ALD for functional MEMS layers.

Deposition Services

Oxide/nitride films, metal films, optical films, composite films and more

Deposition Materials

Metals	Ti, Al, Ni, Au, Ag, Cr, Pt, Cu, Pd, Zn, Mo, W, Ta, Nb and other deposition materials
Non-Metals	Si, SiO₂, SiNₓ, Al₂O₃, HfO₂, MgF2, Ta2O5, ITOetc.deposition materials

Deposition Substrates

Substrates	silicon wafers, quartzglass wafers, sapphirewafers, PET, Pietc.
Substrate Size	2-8Inch

Film Thickness and Surface Options

Thickness	nanometer-level and micrometer-level, customizable on request
Surface	Single-side or double-side

Deposition Technologies

Electron-Beam Evaporation	Ti，Al，Ni，Ag，Cu，Cr，Sn，Pt，AuGe
Magnetron Sputtering	Ti、Al、Ni、Au、Ag、Cr、Pt、Cu、TiW90、Pd、Pt、Zn、Mo、W、Ta、Ru、Si、SiC、NiCr20、Nb
LPCVD (chemical vapor deposition)	SiNₓ, Poly-Si wafers; uniformity: <±5%
Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.	SiO₂，SiNₓ，a-Si(B,PDoping)
Atomic Layer Deposition (ALD)	Al₂O₃、HfO2、AlN、ZrO2、SiO₂、TiN、TiO2

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Wafer Bonding

Wafer Bonding Overview

Wafer bonding integrates silicon, glass or heterogeneous substrates through anodic, eutectic or adhesive bonding for MEMS packaging and cavity structures.

Anodic Bonding

Anodic Bonding	An electric-field-assisted bonding technology
suitable for	Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.

Eutectic Bonding

Eutectic Bonding	Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.
suitable for	PbSn, AuSn, CuSn, AuSietc.materials

Adhesive Bonding

Adhesive Bonding	Uses specialized adhesives to join two surfaces
using	AZ4620, SU8etc.wafer bonding
apply	4inch, 6inch

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Doping

Doping Overview

Doping modifies semiconductor electrical properties by introducing controlled impurities through diffusion, ion implantation, oxidation, annealing and related processes.

Doping

Metal-Organic Chemical Vapor Deposition	GaN，GaAs
Chemical Vapor Deposition	SIC
Ion Implantation	B，P，F，Al，N，Ar，H，He，Si
High-Temperature Oxidation
High-Temperature Diffusion / Annealing
Rapid Thermal Annealing

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Dicing

Dicing Overview

Dicing separates processed wafers into dies or customized shapes while maintaining edge quality and dimensional control for downstream packaging or testing.

Dicing Methods

Laser Dicing	Silicon Substrate
Thickness	100-700μm
Wafer Size	2inch, 4inch, 6inch, 8inch

Blade Dicing

Si, Ge, glass, quartz, , dicing

Applicable Materials

2-8inchwafer

Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.

glass, quartz, , dicing

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Micro Drilling

Micro drilling creates micron-scale holes and vias in glass, silicon, metal wafers or chips for microfluidic, packaging and interconnect applications.

Materials and Services

Materials	glass, metalswafers, silicon wafers, semiconductor, chipsetc.
Micron-Scale Hole Diameter	Micro-hole drilling services available

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Wafer Thinning

Wafer thinning reduces substrate thickness to meet bonding, packaging, back-side processing and device integration requirements.

Wafer Thinningtechnology

Polishingetc.

Applicable Materials

Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.

uniformity

±2um

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Polishing

Polishing improves surface roughness and flatness for wafers and precision substrates before bonding, deposition or further micro/nano fabrication.

Polishing Technology

Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.

Applicable Materials

Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.

surface

1-50nm

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Electroplating

Electroplating forms selected metal layers and microstructures on wafers for electrodes, interconnects, packaging and MEMS functional components.

Electroplating Technologies

waferElectroplating	Au，Cu，Ni，Sn
sizeprocess	Semicon Global Tech provides MEMS foundry services covering photolithography, etching, thin-film deposition, wafer bonding, doping, dicing, micro drilling, wafer thinning, polishing and electroplating. The services support research, prototype verification and small-batch production for MEMS devices, semiconductor materials and micro/nano structures.
Customized service

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