Wafer Bonding
Wafer Bonding Overview
Wafer bonding joins two clean, atomically flat homogeneous or heterogeneous semiconductor material surfaces after surface cleaning and activation. Under controlled conditions, the wafers are bonded into an integrated structure through van der Waals forces, molecular forces or even atomic forces. Semicon Global Tech provides MEMS foundry services and has experience with multiple wafer bonding technologies.
Anodic Bonding
| Anodic Bonding |
An electric-field-assisted bonding technology |
| suitable for |
Wafer bonding joins two wafers or substrates into an integrated structure after surface cleaning, activation and alignment. The service supports anodic bonding, eutectic bonding and adhesive bonding for MEMS cavities, wafer-level packaging, glass-silicon structures and heterogeneous material integration. |
Eutectic Bonding
Eutectic bonding uses metal alloy systems such as AuSn, PbSn, CuSn or AuSi to form a stable bonded interface at controlled temperature.
Adhesive Bonding
Adhesive bonding uses materials such as AZ4620 or SU-8 to join two wafer or substrate surfaces for MEMS packaging and structure integration.
