Thin-Film Deposition
Thin-Film Deposition Overview
Thin-film deposition is a common surface treatment and material formation process. In general, a metal or non-metal material is deposited onto a substrate surface in vapor phase under vacuum conditions to form a dense film. Film quality is critical to the functional performance of semiconductor and MEMS devices. Semicon Global Tech provides MEMS foundry services and supports multiple thin-film deposition technologies.
Deposition Services
Oxide / nitride films, metal films, optical films, composite films and customized functional thin films.
Deposition Materials
| Metals |
Ti, Al, Ni, Au, Ag, Cr, Pt, Cu, Pd, Zn, Mo, W, Ta, Nb and other deposition materials |
| Non-Metals |
Si, SiO₂, SiNₓ, Al₂O₃, HfO₂, MgF2, Ta2O5, ITOetc.deposition materials |
Deposition Substrates
Silicon wafers, quartz wafers, glass wafers, sapphire wafers, PET, PI and other substrates.
Film Thickness and Surface Options
Nanometer- to micrometer-level film thickness; single-side or double-side deposition can be customized according to project requirements.
Deposition Technologies
| Electron-Beam Evaporation |
Ti，Al，Ni，Ag，Cu，Cr，Sn，Pt，AuGe |
| Magnetron Sputtering |
Ti、Al、Ni、Au、Ag、Cr、Pt、Cu、TiW90、Pd、Pt、Zn、Mo、W、Ta、Ru、Si、SiC、NiCr20、Nb |
| LPCVD (chemical vapor deposition) |
SiNₓ, Poly-Si wafers; uniformity: <±5% |
| Thin-film deposition forms functional metal, dielectric, optical or composite films on wafer and substrate surfaces under controlled process conditions. Semicon Global Tech supports electron-beam evaporation, magnetron sputtering, LPCVD and ALD processes for MEMS structures, electrodes, insulating layers and optical films. |
SiO₂，SiNₓ，a-Si(B,PDoping) |
| Atomic Layer Deposition (ALD) |
Al₂O₃、HfO2、AlN、ZrO2、SiO₂、TiN、TiO2 |
