Polishing
Polishing
Polishing reduces the surface roughness of wafers and other workpieces through mechanical, chemical or electrochemical action to obtain a bright and flat surface. It modifies the workpiece surface using polishing tools, abrasive particles or other polishing media. Semicon Global Tech provides MEMS foundry services and supports mechanical polishing, chemical polishing and chemical mechanical polishing for wafer, chip and semiconductor applications.
Polishing Technology
Mechanical polishing, chemical polishing and chemical mechanical polishing can be selected according to substrate material and surface requirements.
Applicable Materials
Silicon, glass, quartz and other wafers or precision substrate materials.
Surface Roughness
Surface roughness and flatness can be controlled according to subsequent process requirements.
