Wafer Thinning
Wafer Thinning
Wafer thinning reduces substrate thickness by controlled grinding, lapping and polishing processes. It is used to meet device thickness requirements, improve packaging compatibility and prepare wafers for bonding, dicing or back-side processing.
Wafer Thinningtechnology
Wafer thinning can reduce substrate thickness to meet downstream bonding, packaging, dicing or back-side processing requirements.
Applicable Materials
Silicon wafers, glass wafers, quartz wafers and other process-compatible substrates.
