Semiconductor Materials | Silicon, Glass, Quartz, SOI & Photomasks

Silicon Wafers

Silicon Wafer Overview

Silicon wafers are core semiconductor substrates supplied in multiple diameters, orientations, resistivity ranges and polishing options for MEMS and IC-related processing.

Silicon Wafer Specifications

Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.

Inch	Diameter / mm	Polished Side	Doping	Crystal Orientation	Resistivity / Ω·cm	Thickness / μm
2inch	50.8±0.5	Double-Side Polished	P/N	100	120	200-500
2inch	50.8±0.5	Single-Side Polished	P/N	100	120	200-500
3inch	76	Double-Side Polished	P/B	100	NA	525±20
3inch	76	Single-Side Polished	P/B	100	NA	525±20
4inch	100±0.2	Double-Side Polished	P/N	100	0.001-10	200-2000
	100±0.3	Single-Side Polished
	100±0.4
6inch	150±0.3	Double-Side Polished	P/N	100	110	500-650
6inch	150±0.3	Single-Side Polished	P/N	100	110	500-650
8inch	200±0.3	Double-Side Polished	P/N	100	0.1-20	625
8inch	200±0.3	Single-Side Polished	P/N	100	0.1-20	625

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Glass Wafers

Glass Wafer Overview

Glass wafers provide optical transparency, dimensional stability and bonding compatibility for MEMS packaging, microfluidic chips and laser debonding processes.

Glass Wafer Specifications

Semicon Global Techprovides 4-inch, 6 inch and otherspecificationsBF33glass wafers

Inch	Diameter / mm	Polished Side	Thickness	Remarks
4inch	100±0.3	Double-Side Polished	500±10	BF33Glass Wafers
6inch	150±0.3	Double-Side Polished	300,500	BF33Glass Wafers

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Quartz Wafers

Quartz Wafer Overview

Quartz wafers offer optical transmission, thermal stability, chemical resistance and electrical insulation for semiconductor, optical and MEMS applications.

Quartz Wafer Specifications

Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.

Diameter / mm	Thickness / mm	Remarks
100mm	500um	1mm	Please contact us for other sizes
150mm	500um	1mm
100*100mm	160um	500um
100mm	155um	260um
200mm	1mm	2mm

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PI Films

PI Film Overview

PI films provide high temperature resistance, chemical stability and flexibility for flexible electronics, sensors, insulation and MEMS device substrates.

PI Film Specifications

Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.

Product Introduction	Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.
Thickness	Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.

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SOI Wafers

SOI wafers combine top silicon, buried oxide and handle silicon layers to improve isolation and performance in MEMS and semiconductor devices.

SOI Wafer Specifications

Semicon Global Techcan provide 4-8 inch and otherspecificationsSOIsilicon wafers

Dimensions	4"、5"、6"、8"
process	Smart cut:Bonding;SIMOX
types	N/P
Top Silicon Layer Thickness	0.22～50μm
Buried Oxide Thickness	0.1～4μm
Handle Layer Thickness	100～500μm

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Photomasks

Photomask Overview

Photomasks transfer designed patterns during lithography and can be customized by substrate type, size and pattern precision.

Photomask Types and Process Capabilities

Photomask Types	Quartz Substrate
	Soda-Lime Glass Substrate
	Film Mask
Process Capability	2.5-inch to 9-inch masks can be customized
	precision±0.3um
	quartz mask precision ±0.1um

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Photoresists

Photoresist Overview

Photoresists define micro/nano patterns during exposure and development and support etching, lift-off and high-resolution MEMS fabrication.

Photoresist Specifications

Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.

types	Photoresist Model	Thickness/um	Resolution	Applicable process
AZ	AZ5214,AZ4620,AZ6130etc.	1-30um	1um	can be used for silicon etching
PI	LTC9000	4-50um	4um	Semicon Global Tech supplies semiconductor materials and micro/nano fabrication consumables, including silicon wafers, glass wafers, quartz wafers, PI films, SOI wafers, photomasks and photoresists. Standard specifications and customized processing support are available for MEMS, semiconductor R&D and pilot production projects.
E-beam Resist	HSQ Fox-15/16	100nm	350nm-810nm	High-resolution photoresist with etch resistance
Lift-off photoresists	LOR/PMGI-SF	50nm-6um	Resolution, lift-off

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