Corning PYREX® Micro-Electro Glass

Original Manufacturer Reference · Corning · Borosilicate / MEMS

Product Overview

Fusion-formed borosilicate glass with an optical-quality surface, low thickness variation and thermal expansion compatible with silicon-based MEMS packaging.

Typical Applications

MEMS and sensor substrates
Wafer-level capping and packaging
Anodic bonding and optical sensor structures

Reference Specifications

The following values are condensed from the supplied manufacturer data sheet. Test conditions are retained where they affect interpretation.

Material / forming	Fusion-drawn borosilicate glass
Wafer thickness	0.2–1.4 mm; standard 0.5, 0.7, 0.85, 1.1 and 1.4 mm
Wafer TTV	≤10 µm standard; ≤1 µm available
Wafer warp	≤100 µm
Panel capability	0.4–1.4 mm; up to 600 × 600 mm; TTV ≤10 µm; warp ≤500 µm
Density	2.234 g/cm³
Young’s modulus / Poisson’s ratio	61.5 GPa / 0.19
Shear modulus / Vickers hardness	25.8 GPa / 520 kgf/mm²
CTE	3.43 × 10⁻⁶/°C, 0–300°C
Refractive index	1.472 at 589.3 nm

China-Made Alternative Products

For a China-made alternative, we match the borosilicate composition class, CTE near silicon, anodic-bonding behavior, TTV/warp, surface finish and optical transmission before recommending a wafer or panel.

Recommended matching criteria:

Low-CTE Chinese borosilicate glass
MEMS-grade wafer and panel formats
Bonding and dimensional validation by sample

Target modelCritical parametersCandidate gradeSample testingBatch qualification

Customization and Processing

Round wafers, square panels, windows and custom outlines
Precision cutting, edge grinding, chamfering and laser processing
Single- or double-side polishing, thinning, cleaning and marking
TTV, warp, roughness, dimensional and optical inspection to agreed criteria

Qualification Note

Important: “Alternative” means a candidate selected for the same application target. It does not mean an automatic drop-in replacement or identical composition. Final acceptance is based on agreed specifications, samples, test reports and process verification.

Request Material Matching

Manufacturer and product names are used only to identify reference materials and technical targets. Semicon Global Tech is an independent supplier and does not claim manufacturer authorization unless explicitly stated. Original-grade data and China-made alternative specifications are presented separately; supply specifications are confirmed by quotation, COA and approved samples.

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