| Wafer capability | 100–300 mm diameter; 0.4–2.0 mm thick; TTV ≤10 µm; warp ≤100 µm |
|---|---|
| Panel capability | 0.4–1.2 mm; up to 600 × 600 mm; TTV ≤15 µm; warp ≤500 µm |
| Density | 2.39 g/cm³ |
| Young’s / shear modulus | 69.3 / 28.5 GPa |
| Poisson’s ratio | 0.22 |
| Vickers hardness / fracture toughness | 534 kgf/mm² / 0.66 MPa·m½ |
| CTE | 7.8 × 10⁻⁶/°C |
| Refractive index / Abbe number | 1.50 / 61.7 |
A China-made candidate is matched to the 7.8-class expansion range, modulus, thickness, flatness and optical/electrical requirements, followed by thermal-cycle and downstream process trials.
Recommended matching criteria:
Manufacturer and product names are used only to identify reference materials and technical targets. Semicon Global Tech is an independent supplier and does not claim manufacturer authorization unless explicitly stated. Original-grade data and China-made alternative specifications are presented separately; supply specifications are confirmed by quotation, COA and approved samples.