Photolithography transfers designed patterns onto a photoresist-coated substrate and defines the geometry for subsequent etching, deposition or implantation.

The process usually includes substrate cleaning, photoresist coating, soft bake, alignment, exposure, development, inspection and post-bake. Resolution, overlay accuracy and resist profile are key indicators of process quality.

In MEMS projects, photolithography must be coordinated with material type, film thickness, etching depth and final device structure. Poor alignment or inappropriate resist selection can lead to dimensional deviation and yield loss.

Different lithography methods, including contact lithography, projection lithography and electron-beam lithography, can be selected according to feature size and project requirements.

Semicon Global Tech provides photolithography services for universities, research institutes and industrial customers developing MEMS and semiconductor devices.