Etching is one of the core pattern-transfer processes in MEMS and semiconductor manufacturing. It selectively removes material from the substrate or film layer according to the lithography-defined pattern.

Depending on material type and structural requirements, etching may use wet chemical etching, reactive ion etching, deep reactive ion etching, ion beam etching or ICP etching. process selection affects sidewall profile, surface roughness, etch rate, selectivity and dimensional accuracy.

High-aspect-ratio silicon structures, micro-cavities, channels, trenches and through-holes all require careful control of etching parameters. Stable masking, uniform plasma conditions and appropriate process recipes are essential for reliable results.

In a foundry project, etching should be planned together with lithography, deposition and bonding steps so that the final structure meets mechanical, electrical and packaging requirements.

Semicon Global Tech supports customized etching services for MEMS R&D, pilot production and small-batch manufacturing.